Intel’s second-gen car chip packs serious AI power
Intel made its debut at Auto Shanghai 2025 with significant announcements, including the launch of its second-generation AI-enhanced software-defined vehicle (SDV) SoC and partnerships with ModelBest and Black Sesame Technologies. The company’s automotive business is headquartered in China, a market Intel views as having massive potential.
Intel VP and Intel Automotive GM Jack Weast stated that the automotive sector is one of the greatest growth opportunities for Intel. He highlighted that the company’s automotive business is part of its Client Computing Group (CCG), alongside PC-related businesses, allowing it to leverage substantial investments in AI PCs. Weast declined to provide the current revenue contribution of Intel’s automotive business.
The second-generation AI-enhanced SDV SoC features a multi-process node chiplet architecture, integrating independent CPU and GPU computing units. This design enables a flexible mix of process nodes for optimal performance. Compared to the first-generation SDV SoC, the new product offers a tenfold increase in AI performance, a 61% boost in CPU power efficiency per watt, and enhanced audio and graphics processing capabilities, supporting up to 12 camera channels.
The new SoC is expected to be installed in mass-production vehicles starting in 2026 and will bring the AI PC experience to vehicles. Weast noted that this will allow users to enjoy AAA games, high-definition video, and audio inside the car. Intel’s partnership with ModelBest will focus on on-device, AI-enhanced smart cockpits, while its collaboration with Black Sesame Technologies will center on immersive cockpit experiences.
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Weast indicated that Intel is open to collaborating with all advanced driver assistance system (ADAS) providers for immersive cockpits. He also hinted at further partnership announcements in 2025. Intel’s entry into the automotive market was first announced at CES 2024 with the launch of its first-generation AI-enhanced SDV SoC, nearly 18 months before the unveiling of the second-generation product.